Doosan

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Smart Device

The highly reliable FR-4 and flexible substrate materials are applied more widely to provide more design freedom for slim products such as smartphone, tablet PC, wearable, laptop and PC.

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IC Package

The IC package substrate is used for high elastic modulus and low CTE to support reliable and thin products with excellent insulation, heat resistance, low permittivity, and stretch stability.

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Networks Equipment

To support high-speed network environment where a large volume of data is transferred, substrate with the characteristics of low dielectric loss and low permittivity is applicable to networks equipment.

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5G/6G Communications

Needed to transfer high volume of data in the 5G/6G communications setting, high-reliable PCB board allows chipsets and network boards to operate stably at Sub-6, mmWave and even Sub-THz.

PFC (Patterned Flat Cable)​

PFC is a core component of EV battery packs. Doosan PFC provides solutions of weight lightening, cost saving, and high reliability thanks to the world's first roll-to-roll manufacturing process.

5G Antenna Module

5G Antenna Module is a core component of 5G wireless repeaters based on beamforming antenna technology, providing comprehensive solutions including signal send and receive, and frequency trasfer.

MEMS Timing Solution

MEMS-based dual output oscillator provides solutions for reduction of PCB space, low power consumption, design simplification, and cost saving.